Automotive LED-Brake Light-7443 27HP3

The interface thermal resistance through the LED package can not only identify the most suitable packaging materials, and can be packaged process optimization, thus effectively reduce the overall thermal resistance of LED package. Among the actual cases from the above analysis, the structure of each layer thermal resistance of packaging materials can be quantitative measurements, interfacial thermal resistance can also be used to identify differences in the structure of the internal packaging defects, and further effective to help the domestic industry to upgrade the quality of LED packages. Conclusion As the LED packaging structure can not directly measure the grain temperature, so how to accurately measure the chip temperature to become an important topic. As the LED gradually applied to the general lighting market, the development of high-power LED must be more rapid, so how to upgrade the LED structure, thermal issues, also Gejia LED industry to work together direction. Interface thermal resistance measurement techniques by the establishment, which can effectively help in the LED packaging industry to enhance the quality of packaging to achieve low thermal resistance package design needs. This technique will also help manufacturers LED quality control functions, and failure mode analysis provides an important reference for all the necessary information in order to enhance the competitiveness of the domestic LED industry.

·        Headlight Bulbs LED

·        Fog Lights, DRL Lamps LED

·        Side Marker Lights LED

·        Parking Position Lights LED

·        Door Courtesy Lights LED

·        Interior Dome Lights LED

·        Turn Signal Lights LED

·        Tail Lights, Brake Lights LED

·        Back Up Reverse Lights LED

·        License Plate Lights LED