LED Lighting-PAR30 9UHP

LED thermal design challenges of large, must be the chip level, package level, PCB-level modules to the system level, we must attach great importance to thermal design, and to seek the best cooling solution. For LED lighting products, because the system more restrictive end of the heat, so the cooling needs of other levels is even more apparent. For the LED heat conduction problem, the most basic method is to use the thermal resistance network analysis. That is, the LED heat from the chip to the ambient temperature cooling path of building a major thermal resistance network, and then analysis of the thermal resistance characteristics and size, so the ideal situation can be calculated when the chip temperature, and for the heat resistive network, under the various parts of countermeasures to reduce the thermal resistance. Package Level, Board Level and System Level composed of thermal resistance network. The actual analysis can be based on system structure composed of a more detailed thermal resistance network, such as consideration of Die Attach Materials and Solder heat resistance materials such as interfaces, or the thermal module structure of the heat resistance.