automotive led-FESTOON 10X31-6HP3

At present, a lot of power type LED drive current to reach 70 mA, 100 mA or 1 A, this would give rise to internal heat gathered chip, resulting in emission wavelength drift of optical efficiency, accelerate the aging of phosphors and a range of issues such as life shortening. High-power LED industry has made the heat a lot of efforts: the extension of structural optimization of chip design, the use of technology, such as rough surface to improve internal and external quantum efficiency of the chip to reduce the non-radiation composite lattice oscillation generated fundamentally reduce cooling load components; by optimizing package structure, materials, choice of aluminum-based metal-core printed circuit board (MCPCB), the use of ceramics, composite metal substrates and other methods to speed up the heat from the substrate layer to distribute heat.